Chapter 17 - St. Louis Scholarship

Applicant must be a student enrolled in a manufacturing engineering, industrial technology, or other related program. First preference will be given to applicants who reside within the boundaries of St. Lewis Chapter 17. Second preference will be given to applicants who reside within the state of Missouri. A minimum 2.5 GPA is required.

Award may only be used only as a credit toward books, fees, or tuition.

Recipient must reapply for renewal.

Study areas: manufacturing engineering, industrial technology

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Details

Deadline:
February 1
Award type:
Scholarship
Renewable
Yes
Min. award:
$1,000
Awarded anualy:
Yes
Unlimited awards:
No
Repay required:
No

Other criteria

Min. GPA:
3
Max. GPA:
4

Misc.

Enrollment level:
College senior,College sophomore,College junior,College freshman
Country:
United States
State:
Missouri
Major:
Industrial/Manufacturing Engineering,Manufacturing Engineering,Industrial/Manufacturing Tech./Technician
Misc:
Full-Time Student,Part-Time Student,St. Lewis Chapter 17 Resident